VB325SP Chipset in HSOP10 Package Key benefits - Compact HSOP10 package enables dense board layouts and space-efficient designs. - Consistent VB325SP performance within the VB325 family for reliable operation in space-constrained applications. - Ready-to-use 10-piece pack simplifies procurement, stocking, and project planning. - Suitable for surface-mount assembly and automated reflow processes, supporting modern manufacturing. Key attributes - Model: VB325SP; Variant: VB325 - Package: HSOP10 (Speed Small Outline Package with 10 leads) - Type: Chipset - Quantity: 10 pieces per pack - Footprint and form factor aligned to HSOP10 applications - Designed for incorporation into electronic assemblies requiring the VB325SP variant Compatibility and use considerations - Intended for use in projects and products designed for HSOP10 packaging and the VB325 family. - Verify exact electrical characteristics, pinout, and thermal requirements against the official VB325SP datasheet prior to design-in or replacement. - Suitable for automated placement in standard surface-mount PCB fabrication and assembly workflows. Applications and use cases - Replacement or integration in electronic devices that use VB325SP or VB325 components on HSOP10 footprints. - Design-in for compact embedded systems and consumer electronics requiring a VB325SP chipset in an HSOP10 package. - Prototyping and development work where a small-footprint VB325SP part is needed for testing functionality and integration with HSOP10 boards. Packaging details - Includes 10 pieces per pack to support small-batch procurement, test builds, and stocking efficiency. - Packaged to support safe handling and storage for electronic components in typical workshop environments. Notes - This description reflects branding and model information indicated by the product title. For exact electrical specifications, timing, pin configuration, and thermal data, consult the official VB325SP datasheet and your design requirements before use.