Features: 1.Scope of Application: Suitable for electronic products, CPU, GPU, power LED, computer host, laptop, LED IC SMD dip and any cooling module 2.Excellent Performance: Upgraded thermal silica gel material, with a thermal conductivity of 13.8w/mk, which greatly improves the heat transfer between electronic components and effectively cools the temperature in a few seconds 3.Wide Range Applications: Used between notebook and desktop graphics card IC, CPU, hard disk and shell, cooling parts and chassis or chassis 4.Good Insulation: High temperature performance at ? 40 ? 200 will not dissipate heat, non toxic, tasteless, anti corrosion, wear resistant, anti static, flame retardant, compression and good insulation 5.Embedded Module: Voltage regulation module for DSPs, high speed and large storage drive module with high heat BGAs and high heat conduction demand specification:Item Type: Thermal Pad Material: Silicone Thermal Conductivity: 13.8W/mk Density: 3.3 0.1 Hardness: 40-80Sc Breakdown Voltage: > 6KV / mm Temperature Resistance Range: - 40- 200 Size: Approx.90 x 60 x 0.5mm / 3.5 x 2.4 x 0.02in Approx.90 x 60 x 1.0mm / 3.5 x 2.4 x 0.04in Approx. 90 x 60 x 1.5mm / 3.5 x 2.4 x 0.06in Approx. 90 x 60 x 2.0mm / 3.5 x 2.4 x 0.08in Approx. 90 x 60 x 2.5mm / 3.5 x 2.4 x 0.1in Approx. 90 x 60 x 3.0mm / 3.5 x 2.4 x 0.12in Compatible Devices: Laptop, Desktop PackageList:1 x Thermal Pad