Item Type: Thermal Pad <br>Material: Silicone <br>Thermal Conductivity: 13.8W/mk <br>Density: 3.3 ± 0.1 <br>Hardness: 40-80Sc <br>Breakdown Voltage: > 6KV / mm <br>Temperature Resistance Range: - 40℃- 200℃ <br>Size: <br>Approx.90 x 60 x 0.5mm / 3.5 x 2.4 x 0.02in <br>Approx.90 x 60 x 1.0mm / 3.5 x 2.4 x 0.04in <br>Approx. 90 x 60 x 1.5mm / 3.5 x 2.4 x 0.06in <br>Approx. 90 x 60 x 2.0mm / 3.5 x 2.4 x 0.08in <br>Approx. 90 x 60 x 2.5mm / 3.5 x 2.4 x 0.1in <br>Approx. 90 x 60 x 3.0mm / 3.5 x 2.4 x 0.12in <br>Compatible Devices: Laptop, Desktop1、Scope of Application: Suitable for electronic products, CPU, GPU, power LED, computer host, laptop, LED IC SMD dip and any cooling module <br>2、Excellent Performance: Upgraded thermal silica gel material, with a thermal conductivity of 13.8w/mk, which greatly improves the heat transfer between electronic components and effectively cools the temperature in a few seconds <br>3、Wide Range Applications: Used between notebook and desktop graphics card IC, CPU, hard disk and shell, cooling parts and chassis or chassis <br>4、Good Insulation: High temperature performance at ? 40 ℃ ? 200 ℃ will not dissipate heat, non toxic, tasteless, anti corrosion, wear resistant, anti static, flame retardant, compression and good insulation <br>5、Embedded Module: Voltage regulation module for DSPs, high speed and large storage drive module with high heat BGAs and high heat conduction demand1 x Thermal Pad