Item Type: Thermal Pad_x000D_ Material: Silicone_x000D_ Thermal Conductivity: 13.8W/mk_x000D_ Density: 3.3 0.1_x000D_ Hardness: 40-80Sc_x000D_ Breakdown Voltage: > 6KV / mm_x000D_ Temperature Resistance Range: - 40- 200_x000D_ Size: _x000D_ Approx. 30 x 30 x 0.5mm / 1.2 x 1.2 x 0.02in_x000D_ Approx.30 x 30 x 1.0mm / 1.2 x 1.2 x 0.04in_x000D_ Approx. 30 x 30 x 1.5mm / 1.2 x 1.2 x 0.06in_x000D_ Approx. 30 x 30 x 2.0mm / 1.2 x 1.2 x 0.08in_x000D_ Approx. 30 x 30 x 2.5mm / 1.2 x 1.2 x 0.1in_x000D_ Approx. 30 x 30 x 3.0mm / 1.2 x 1.2 x 0.12in_x000D_ Compatible Devices: Laptop, Desktop1Excellent Performance: Excellent thermal conductivity, upgraded thermal silica gel material, with a thermal conductivity of 13.8w/mk, which greatly improves the heat transfer between electronic components and effectively cools the temperature in a few seconds 2Scope of Application: Suitable for electronic products, CPU, GPU, power LED, computer host, laptop, LED IC SMD dip and any cooling module 3Good Insulation: High temperature performance at ? 40 ? 200 will not dissipate heat, non toxic, tasteless, anti corrosion, wear resistant, anti static, flame retardant, compression and good insulation. Contact with any electrical trace will not cause any form of damage 4Embedded Module: Voltage regulation module for DSPs, high speed and large storage drive module with high heat BGAs and high heat conduction demand 5Wide Range of Applications: Used between notebook and desktop graphics card IC, CPU, hard disk and shell, cooling parts and chassis or chassis1 xThermal Pad