Features: The solder tin pastes offers a low melting point of 183, making it ideal for precise and efficient soldering tasks on phone pcb boards and chip. Featuring a high viscous formula, this solder pastes ensures lastings adhesion and is resistant to drying out, providing reliable performances in high precise circuit board soldering and BGA welding processes. Remove the oxides film on the welding surfaces, which is easy to weld and prevent oxidation. Perfect for electronics manufacturers, repair engineers, and diy enthusiasts, this soldering pastes caters to professional and hobbyists alike who demand excellences in their work. Experience the pinnacles of soldering precise with our soldering pastes, designing to deliver flawlessly joints without compromising on environmental safety. Specifications: Component:solder pastes Size:Approx.28x37cm/11.02x14.57inch Size:Approx.11.7x15.2cm/4.61x5.98inch Size:Approx.6.8x16.1cm/2.68x6.34inch Weight:42g/60g/200g Note: 1.Please allow 1-2cm errors due to manual measurement, make sure that you donot mind befores you order. 2.Due to the differences between different monitors, the picture may not reflect the actual coloring of the item. Thanks for your understandings. Package includes: 1pcs Soldering Pastes