Features 1、HIGH PERFORMANCE: Environmentally friendly soldering paste, which is easy to tin, no residue, with high insulation resistance. 2、FOR PACKAGE WORKS: Can be used for rework, BGA, PGA and CSP package pin connections, such as flipping chips to PWB substrates. 3、GOOD ADHESION: The solder paste has excellent solder adhesion, moisture resistance, and is suitable for multi PCB reflow soldering. 4、PORTABLE DESIGN: With a capacity of 100g/3.5oz, has compact structure, easy to use and carry, and strong practicability. 5、WIDE APPLICATION: Used for soldering of sensors, wires, connecting protection tubes, BGA chips, etc., convenient and efficient. Specification Item Type: Solder Paste Applications: Universally used in sensors, wires, even protection tubes, BGA chips, etc. Product Features: Environmental protection, easy to tin, no residue, high insulation resistance Capacity: Approx. 100g / 3.5oz Package List 1 x Solder Paste