Iron Circuit Board Repair Solder Paste. FEATURES: Advanced Insulation Technology a High Viscosity No-clean Flux It Can Be Used for PCB SMD Reworking As Well As Reballing of Computer and Phone Chips. The Mixture of High-quality Alloyed Powder and Resinic Pasty Flux Which Avoid the Pale Yellow Residue So You Are Easy to Clean the Board. Super Compacity: Soldering Paste for Cell Phone PCB SMD PGA and Computer Etc. Help to Repair the Circuit Boards and Protect the Electronic Components Flux Solder Paste - No Clean Soldering Syringe Solder Paste is an Ideal Assistant for Phone Motherboard and Repairing Cell Phone Surface Mount Assemblies. The Syringe Plunger Will Provide Premium Activity Levels with Maximum Wetting and Spreading 10cc Syringe is Available for All Rework Soldering and Desoldering Repairs. Perfect Performance Easy to Weld. Suitable for Mobile Phone Repair Industry Computer Digital Service Industry High-precision Circuit Board SMD Welding BGA Welding Technology and So On. SPECIFICATIONS: Material: Tin+Solder Past Type: BGA Soldering Tin Cream Volume: 10CC Alloy: Sn63/Pb37 Design: Squeeze Tube Needle Dispense Microns: 20-38u Application: Applicable to Phone PCB BGA SMD PGA Repair Usage: PCB BGA Repairing Tool Function: Repair the Circuit Boards Protect The Electronic Components . We are an international based seller that will ship your order from abroad please at least a minimum 14 working days for delivery right now due to the ongoing delays in shipments globally. Note: Due to the light and screen setting difference, the item's color may be slightly different from the pictures. Please allow slight dimension difference due to different manual measurement.