Enhance your BGA soldering projects with this versatile 6-in-1 BGA stencil set, expertly crafted to support multiple chip types with precision and efficiency. Made from high-quality stainless steel, these stencils feature an optimal steel mesh thickness that ensures durability and consistent performance. Designed with a special plump structure, the stencils effectively minimize heat dissipation during reballing, improving soldering quality and reliability. This set is an essential, economical accessory for fast and easy reballing of BGA ICs, making it ideal for both professional technicians and hobbyists. Key Features: · 6-in-1 Multi-Chip Design: Supports a variety of BGA chip sizes, allowing implantation of multiple chips with one convenient stencil set. · Premium Stainless Steel Material: Constructed from high-quality stainless steel plate, offering excellent wear resistance and long-lasting use. · Optimal Steel Mesh Thickness: Precisely engineered mesh thickness ensures accurate solder paste application and consistent results. · Special Plump Design: Innovative structure reduces heat dissipation, enhancing soldering efficiency and protecting components. · Fast and Easy Reballing: Streamlines the BGA IC reballing process, saving time and effort while maintaining high-quality solder joints. · Wide Compatibility: Specifically designed for BGA153, BGA162, BGA169, BGA186, BGA221, BGA254, EMMC, and other common BGA chip sizes. Specifications: · Material: High-Quality Stainless Steel · Weight: Approx. 6g · Compatible with: BGA60, BGA70, BGA110, BGA153, BGA162, BGA169, BGA178, BGA186, BGA200, BGA221, BGA254, BGA297, EMMC Package Includes: · 1 x BGA Stencil Set This 6-in-1 BGA stencil set is an indispensable tool for precise and efficient BGA reballing, offering excellent durability, heat resistance, and compatibility across multiple chip sizes. Improve your soldering workflow with this reliable and economical accessory designed to deliver professional results every time.