Features: Thermalright creates an anti-bend solution for intel's Lake processors. Intel's Lake processors are prone to flexing and warping, a flaw with the LGA1700 CPU's latching system. In response to this problem, an "anti-bend frame" was developed, designed to prevent warping/bending of Lake CPUs. The LGA1700-BCF, an aluminum frame that replaces the CPU mounting mechanism of company's LGA1700 CPU socket. This frame fits around the processor and is secured with simple screws. The frame applies more even pressure to Intel's Lake processors, reducing the chance of warping. However, warns that this mounting solution could your CPU , so consumers should be aware of this. This LGA 1700 Anti-Bend Buckle adopts an all-aluminum gold anodized sandblasting process, with an overall size of 70 x 54 x 6 mm and an overall weight of 55g. Its precise positioning can avoid the capacitors on the motherboard, and uses the original LOTES insulation protection pads, and also provides different color schemes. Compared with the previous home-made brackets, this LGA 1700 anti-bending buckle is much more comprehensive in design and better quality. What's more, the price is very affordable. Z690, B660 and H610 motherboards can use this LGA 1700 anti-bending clip. Specifications: Name: CPU Anti-Bending Frame Material: aluminum alloy Color: black Size: approx. 53x70x6mm/2.09x2.76x0.24'' Applicable: Only provide support for intel 12th generation CPU, and the chipset is H610 B660 Z690 series Package Includes: 1 X CPU Bending Corrector 1 X L-shaped Screwdriver Note: Due to the different monitor and light effect, the actual color of the item might be slightly different from the color showed on the pictures. Thank you! Please allow 1-2cm measuring deviation due to manual measurement.