- Streamline your chip testing process with our blown socket solution, specifically designed for QFP64, LQFP64, and TQFP64 package chips. This product guarantees compatibility and consistent testing results. - Ideal for electronic manufacturing workshops conducting batch aging tests and laboratories focused on evaluating chip performance and long-term stability. - Tailored for semiconductor engineers and electronic lab technicians who require reliable and professional tools for chip testing and aging processes. - Our heat-resistant burner plug offers vital support for precise testing and aging of QFP64, LQFP64, and TQFP64 chips, enhancing the integrity of your testing results. Use Scenarios: - Implement during batch testing in manufacturing to validate chip reliability over extended periods, ensuring product quality and customer satisfaction. - Utilize in research laboratories for performance assessments, particularly critical when developing next-generation semiconductor technologies. - Employ in quality control environments to systematically age chips, allowing for the identification of potential long-term failure risks. This product not only meets strict technical requirements but also enhances your testing workflow, providing the necessary tools for effective chip performance evaluation.