Product Description: SFD‑229 Normal Temperature LED Solder Paste for Mobile Phone Repair Superior Printing Performance: The SFD‑229 solder paste is engineered for strong continuous printing performance, making it ideal for welding fine pitch ICs, BGAs, and other precise components. Its reliable formulation ensures consistent and high-quality results, even for the most demanding soldering tasks. Excellent Wettability and Mold Release: This solder paste offers excellent wettability and mold release properties, providing robust resistance to both cold and hot collapse. Its dry resistance ensures that the paste maintains its effectiveness under various environmental conditions, ensuring a stable soldering process. Versatile for High-Precision PCB Welding: Perfectly suited for PCB welding with high-requirement materials, the SFD‑229 is designed for fine pitch and high-precision components. It minimizes the risk of shifting and short tombstoning, ensuring reliable and accurate soldering results every time. Clean and Safe Composition: The tin in this paste is characterized by bright tin beads, leaving minimal residue that is less white and transparent. Importantly, it contains no strong corrosive substances such as fluorine, making it a safer choice for both the user and the environment. Active and Rinse-Free Formula: The SFD‑229 is an active, rinse-free solder paste with minimal residuals. It is high in antioxidants, which helps to prevent oxidation and maintain the quality of the solder joints over time. Choose the SFD‑229 Normal Temperature LED Solder Paste for your mobile phone repair needs. Its advanced formulation and user-friendly properties make it the perfect choice for professionals seeking reliability, precision, and safety in their soldering projects.